China's First Automotive-Grade Multi-Domain Fusion Chip "Hongqi 1" Successfully Developed

FAW Group, in collaboration with industry partners, has launched "Hongqi 1", China's first domestically developed automotive-grade, advanced-process multi-domain fusion chip. The chip integrates five major functional domains—driver assistance, intelligent cockpit, vehicle body control, and more—achieving an integrated "cockpit, drive, and control" architecture.

In terms of computing power, the chip delivers a 21.7% improvement in logical computing capability and a 15.4% improvement in image processing capability compared to mainstream domain fusion chips (e.g., SA8775). It efficiently supports complex cockpit scenarios such as "one chip driving multiple screens and parallel multi-OS", and reserves ample computational redundancy for future integration of high-level intelligent driving and cockpit functions.