According to ZDNet, citing industry sources, SK hynix is collaborating with Intel on the research and development of 2.5D packaging technology. It is reported that SK Hynix is considering adopting Intel's 2.5D packaging technology, known as “Embedded Multi-die Interconnect Bridge” (EMIB), and is currently conducting tests to combine HBM and system semiconductors with EMIB-embedded substrates supplied by Intel.
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