According to South Korean media reports, Samsung plans to stop using FOWLP technology on the Exynos 2700, a packaging technology that has been used since the Exynos 2400. It is reported that the Exynos 2700 chip is currently being developed for next year's flagship smartphones. Although FOWLP technology improves heat dissipation performance, Samsung has begun to reassess its profitability due to increased manufacturing costs.
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