Hanmi Semiconductor Reportedly Signs KRW 44.2 Billion TC Bonder Supply Deal with SK hynix

According to South Korean media inews24, Hanmi Semiconductor has announced that it has signed a supply contract worth 44.2 billion won with SK hynix to provide "TC Bonder 4.5 Griffin" for the manufacturing of HBM4 chips. The contract runs from the signing date to September 2. TC bonder is a core piece of equipment in the HBM manufacturing process, using heat and pressure to vertically stack multiple DRAM chips. It determines stacking precision and yield, and is considered as a key factor in HBM production competitiveness. With each unit priced at approximately 3 billion won, industry insiders estimate that SK hynix will procure around 15 machines. It is highly likely that the equipment will be deployed at the Cheongju M15X plant.