Applied Materials Unveils Series of 3D Manufacturing Equipment for AI Chips, Targeting HBM Stacking Processes

Applied Materials has unveiled its product line of three-dimensional (3D) chip manufacturing equipment for AI semiconductors. The series primarily focuses on planarization, deposition, and metrology and inspection required for advanced packaging processes such as high-bandwidth memory (HBM), chiplets, and hybrid bonding. Specifically, the offerings include advanced chemical mechanical polishing (CMP), electrochemical deposition (ECD), and plasma-enhanced chemical vapor deposition (PECVD) equipment for packaging applications, along with newly added electron-beam-based process control tools and enhanced epitaxial equipment for DRAM processes.