MediaTek releases next-generation Genio smart IoT platform, with high-end models using 3nm process and supporting LPDDR5X memory

On March 10th, MediaTek launched its next-generation Genio smart IoT platform at Embedded World in Nuremberg, Germany. Primarily targeting robotics, commercial drones, and industrial IoT applications, it provides advanced edge AI computing capabilities.

The launched products cover different market segments. The mainstream Genio 420 uses a 6nm process, integrates 16GB of LPDDR5X memory, provides 7.2 TOPS of system-level AI computing power, supports dual-socket 2.5K60 or single-socket 5K60 displays, and is pin-compatible with the Genio 720 and Genio 520, facilitating flexible design expansion for device manufacturers.

The high-end Genio Pro uses TSMC's advanced 3nm process, integrating an all-core Arm V9.2 architecture CPU, including one Cortex-X925 super core, three Cortex-X4 cores, and four Cortex-A720 cores, achieving a computing performance of up to 260,000 DMIPS. It also supports 64-bit LPDDR5X memory with speeds up to 8533Mbps, providing high-speed data access capabilities for advanced IoT applications.

Currently, the Genio 360 series is being sampled, the Genio 420 is expected to be sampled in April 2026, and the Genio Pro will be sampled in the first quarter of 2026 and mass-produced in the third quarter.

Wang Zhenguo, General Manager of MediaTek's IoT Business Unit, stated, "The Genio Pro fully integrates MediaTek's advantages in flagship mobile communications and computing into the IoT industry, possessing superior edge-side generative AI computing power, making it an ideal choice for device manufacturers developing AI and generative AI applications."