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CFMS | MemoryS 2026
CFMS｜MemoryS 2026: Shenzhen, March 27

CFMS｜MemoryS 2026: Shenzhen, March 27

Persistent Upstream NAND Price Hikes Prompt Memory Makers to Strengthen Cost Control, Driving Most Finished Product Prices to New Highs

Persistent Upstream NAND Price Hikes Prompt Memory Makers to Strengthen Cost Control, Driving Most Finished Product Prices to New Highs

Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%

Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%

Micron Unveils World's Fastest Data Center SSD: The 9550 Series

2024-07-24 06:32 (UTC+0) Enterprise News

Hanmi Semiconductor to Expand Production Capacity with New Factory for TC Bonding Machines

2024-07-23 08:58 (UTC+0) Industry News

JEDEC Unveils DDR5 MRDIMM and LPDDR6 CAMM Standards to Accelerate High-Performance Computing and AI

2024-07-23 03:03 (UTC+0) Industry News

SEMI Calls for Unified Standards in Chip Packaging and Backend Processes

2024-07-22 09:03 (UTC+0) Industry News

Kioxia Holdings Secures Ongoing Investment from Development Bank of Japan

2024-07-22 06:56 (UTC+0) Enterprise News

Samsung Gears Up for CXL 2.0 DRAM Mass Production by Year-End

2024-07-22 06:52 (UTC+0) Enterprise News

TSMC's Q2 2024 Earnings Call Highlights and Future Outlook

2024-07-19 03:10 (UTC+0) Industry News

GlobalWafers Receives $400 Million U.S. Funding for Semiconductor Wafer Production

2024-07-18 08:33 (UTC+0) Industry News

TSMC Forecasts Record Q3 Revenue and Significant Increase in 2024 Capital Expenditure

2024-07-18 08:27 (UTC+0) Industry News

Samsung to mass-produce HBM4 on 4 nm foundry process

2024-07-17 06:55 (UTC+0) Industry News

Micron MRDIMM starts sending samples

2024-07-17 06:52 (UTC+0) Enterprise News

OPENEDGES Successfully Validated Its 7nm HBM3 Testchip

2024-07-17 03:02 (UTC+0) Industry News

SK Hynix's HBM4 Memory to Utilize TSMC's N5 Foundation Die

2024-07-17 02:30 (UTC+0) Enterprise News

Samsung Electronics Halts Construction of P4 Phase 2 Foundry Production Line

2024-07-16 02:58 (UTC+0) Enterprise News

HBM3E 12-Layer Product Emerges as a Key Player in the AI Semiconductor Market

2024-07-16 02:56 (UTC+0) Industry News

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Newsflash

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6 hours ago
The U.S. Department of Commerce reaches $252 million settlement with Applied Materials in connection with illegal export of chip equipment to China
6 hours ago
Xiaomi Auto Delivers Over 39,000 Units in January, YU7 Takes Top Spot in Overall Sales
6 hours ago
Hua Hong Semiconductor Reports Record High Q4 2025 Revenue, Full-Year Sales Exceed US$2.4 Billion
8 hours ago
South Korea's KOSPI index hits record high; global memory sector rally in tandem
8 hours ago
Lenovo's Q3 Results Hit Record High; Yang Yuanqing Warns Memory Prices May Double
9 hours ago
Samsung Electronics: Industry-First Mass Production and Delivery of HBM4, HBM Sales Projects to More Than Triple in 2026
9 hours ago
Kioxia: FY25Q3 Profit Attributable to Owners of Parent Up 114.6% QoQ, Driven by Higher ASP and Bit Shipments
16 hours ago
Micron CFO: HBM4 Mass Production and Shipments Start, One Quarter Ahead of Schedule
1 day ago
Global Storage Sector Closing Recap, February 11
1 day ago
SMIC's Zhao Haijun: Consumer Electronics Memory Supply Expected to Improve in Q3 2026, AI Data Center Shortage to Persist for Several Years

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Samsung Electronics: Developing zHBM, Which Cores on Stacking HBM into a 3D Structure

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