Nanya Technology recently disclosed its progress in developing customized AI memory for the first time. The company's UltraWIO (Ultra-Wide Input/Output Interface) architecture memory has partnered with several logic IC manufacturers, and some products have entered the trial production stage. More concrete results are expected in the second half of the year. This technology significantly increases the number of data channels to improve AI computing efficiency. In the future, it will utilize 3D stacking and advanced packaging technologies to target the edge AI device market, such as AI PCs and AI smartphones, opening up a new customized battleground beyond standard DRAM.