AI Packaging Capacity in Short Supply, Five Major Packaging and Testing Companies ramp up capital expenditures to seize the initiative

Demand for AI chips continues to surge, with advanced packaging capacity unable to meet supply. The expansion boom is rapidly spreading from TSMC (2330-TW) (TSM-US) to the packaging and testing sector. The five major companies—ASE Technology Holding (3711-TW) (ASXUS), King Yuan Electronics (2449-TW), Powertech Technology (6239-TW), Siliconware Precision Industries (6257-TW), and Hsin Chuan (3264-TW)—have all significantly increased their capital expenditures in 2026, totaling over NT$300 billion, setting new historical records and striving to seize the initiative in the AI ​​packaging and testing market.