Samsung Electronics announced that it has begun shipping the industry’s first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market.Samsung’s HBM4E delivers a stable pin speed of 14 gigabits-per-second (Gbps), with performance scalable up to 16Gbps to support increasingly intensive data processing requirements. This represents more than a 20% increase over its HBM4, while delivering memory bandwidth of up to 3.6 terabytes-per-second (TB/s) per stack, helping maximize computing performance for large language models (LLMs) and next-generation AI systems.