Solidigm Announces New Co-CEOs Xin Guo and Richard Chin

Solidigm announced new co-chief executive officers, Xin Guo and Richard Chin.

Guo, named co-CEO in March, drives Solidigm’s global business strategy and execution across technology and engineering to deliver market-leading innovation. Chin assumed his role on May 1 and is focused on accelerating Solidigm’s performance and expanding its capabilities, sharpening business processes, and advancing the company’s growth trajectory.

Guo previously served as acting co-CEO and Head of Data Center Engineering for Solidigm. His career spans key leadership roles advancing NAND Flash and SSD systems at Intel, Numonyx, and Spansion. Guo holds 40 U.S. patents and earned his PhD in Electrical Engineering from Yale University, with earlier degrees from Tsinghua University.

Chin brings to Solidigm extensive SK Group experience where, among other roles, he started SK’s first venture capital operation for SK Telecom, led commercial integration of Hynix Semiconductors into SK, and served as Chief Sales and Marketing officer for SK hynix. Chin earned a bachelor’s in economics from the University of Chicago and a J.D. at John Marshall Law School.