MediaTek's Next-Gen Chips to Exclusively Use Intel EMIB-T Packaging, Mass Production Targeted for Q4 2027

During the Goldman Sachs event held at COMPUTEX 2026, MediaTek announced that its next-generation chips will exclusively adopt Intel's EMIB-T advanced packaging technology, moving away from TSMC's CoWoS solution. MediaTek revealed that tape-out for the project is targeted for the fourth quarter of 2026, with mass production planned for the fourth quarter of 2027. Although it is currently unclear which specific chips are covered under this project, industry insiders widely believe that custom AI chips and CPUs will be involved.