Samsung Electronics Reportedly Develops '2.xD' Packaging

According to foreign media reports, Samsung is focusing on developing "2.xD" packaging technology to resolve power consumption and heat dissipation issues. It is introduced that on the basis of existing silicon interposer-based packaging, the '2.xD' technology aims to integrate HBM, logic chips, and silicon photonics (optical semiconductor) technology into a single system by applying panel-based redistribution layer (RDL) interposers. It is said that the ultimate plan is to evolve it into high-capacity, high-bandwidth system packaging for AI data centers.