Qualcomm Announces 2nm Chip Tape Out from India

On February 7th, Qualcomm announced the successful completion of the tape-out process for 2nm chip in India and showed wafer samples to the public. This milestone achievement marks a significant step in Qualcomm's global semiconductor technology roadmap, demonstrating its long-term commitment to supporting and accelerating the development of India's semiconductor industry. It also underscores India's central role in Qualcomm's strategic plans and further solidifies the country's position as a crucial hub for advanced semiconductor development.

The design that has completed the tape-out process is expected to be used in the Snapdragon 8 Elite Gen 6 processor and Snapdragon X Elite 3 chip, powering flagship Android smartphones by the end of 2026.

Additionally, Ashwini Vaishnaw, Minister of Indian Electronics and Information Technology, revealed that the next step for India is to build domestic 2nm wafer fabrication plants to further advance local semiconductor manufacturing capabilities.