ASML Announces Major Breakthrough in EUV Lithography, Potentially Boosting Chip Production Capacity by 50% by 2030

ASML has recently announced a significant breakthrough in extreme ultraviolet (EUV) lithography technology, successfully increasing the power of its light source from 600 watts to 1,000 watts. This advancement is expected to enhance chip production capacity by 50% by 2030, enabling major semiconductor manufacturers like TSMC and Intel to significantly boost production to meet the growing demand in artificial intelligence (AI) and high-performance computing (HPC).

EUV lithography is a crucial process for manufacturing the most advanced semiconductor chips. The technology works by using lasers to strike molten tin droplets, generating extreme ultraviolet light at a 13.5-nanometer wavelength. Teun van Gogh, Executive Vice President of ASML's NXE EUV equipment, stated that by the end of this decade, each machine will be capable of processing approximately 330 silicon wafers per hour—an increase of 50% from the current 220 wafers. This will significantly reduce the cost per chip, helping customers maintain a competitive edge in an increasingly crowded market.

ASML's Chief Technology Officer, Michael Purvis, emphasized that this achievement is "not a gimmick, nor something that only works for very short demonstrations," but rather a system capable of stably delivering 1,000 watts of power under real-world customer conditions.

As the world's only commercial supplier of EUV lithography machines, ASML holds an irreplaceable position in the advanced semiconductor manufacturing value chain. The demand for EUV equipment continues to grow, closely linked to the rapid expansion of AI applications. According to ASML’s Q4 2025 financial report, the company's EUV equipment orders reached €7.4 billion, marking a 146.7% year-on-year increase.