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Cisco Unveils 3nm AI Network Chip Silicon One G300, Defining the Foundation for the "Agent Era" Network with 102.4Tbps Bandwidth

2026-02-13 03:55 (UTC+0) Industry News

Hua Hong Semiconductor's Q4 2025 Revenue Hits Record High, Driven by eNVM and PMIC Platforms

2026-02-12 12:15 (UTC+0) Industry News

Lenovo's Q3 Results Hit Record High; Yang Yuanqing Warns Memory Prices May Double

2026-02-12 10:27 (UTC+0) Industry News

Samsung Electronics: Industry-First Mass Production and Delivery of HBM4, HBM Sales Projects to More Than Triple in 2026

2026-02-12 10:06 (UTC+0) Industry News

Micron CFO: HBM4 Mass Production and Shipments Start, One Quarter Ahead of Schedule

2026-02-12 02:29 (UTC+0) Industry News

South Korea Invests 4.5 Trillion Won to Build 40nm Wafer Fab, Implementing Multiple Measures to Support Fabless Enterprises

2026-02-11 10:25 (UTC+0) Industry News

Samsung Electronics: Developing zHBM, Which Cores on Stacking HBM into a 3D Structure

2026-02-11 09:08 (UTC+0) Industry News

SK Hynix is Developing New Technology “AIP” to Reduce NAND Manufacturing Cost

2026-02-11 09:08 (UTC+0) Industry News

South Korea's semiconductor exports increased by 137.6% year-on-year in early February, reaching $6.73 billion

2026-02-11 09:03 (UTC+0) Industry News

SMIC Announces Q4 2025 Financial Results: Steady Progress in Performance

2026-02-10 10:03 (UTC+0) Industry News

Samsung to Begin Mass Production of HBM4 as Early as Next Week, Projects Over Threefold Increase in HBM Sales This Year

2026-02-10 09:57 (UTC+0) Industry News

CFM Reports Latest DDR5 RDIMM Prices, Exceeding 100% Increase Compared to Last Quarter

2026-02-10 09:39 (UTC+0) Weekly Review

Intel and AMD Face Server CPU Delivery Delays in China Due to 3nm Capacity Bottleneck

2026-02-10 09:07 (UTC+0) Industry News

Lexar Launches JumpDrive Solid State Dual Drive D500 USB

2026-02-10 08:17 (UTC+0) Enterprise News

Strong Demand for Memory Chips Drives Full Capacity at Winbond Electronics, DRAM Contract Prices Surge by Nearly 50%

2026-02-10 08:15 (UTC+0) Industry News

2025-2026 Global Memory Market Trend White Paper

Global Memory Market Hits Record High, 4Q25 DRAM/NAND Flash Revenue Market Share Rankings Released

Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%

Cisco Unveils 3nm AI Network Chip Silicon One G300, Defining the Foundation for the "Agent Era" Network with 102.4Tbps Bandwidth

Hua Hong Semiconductor's Q4 2025 Revenue Hits Record High, Driven by eNVM and PMIC Platforms

Lenovo's Q3 Results Hit Record High; Yang Yuanqing Warns Memory Prices May Double

Samsung Electronics: Industry-First Mass Production and Delivery of HBM4, HBM Sales Projects to More Than Triple in 2026

Micron CFO: HBM4 Mass Production and Shipments Start, One Quarter Ahead of Schedule

South Korea Invests 4.5 Trillion Won to Build 40nm Wafer Fab, Implementing Multiple Measures to Support Fabless Enterprises

Samsung Electronics: Developing zHBM, Which Cores on Stacking HBM into a 3D Structure

SK Hynix is Developing New Technology “AIP” to Reduce NAND Manufacturing Cost

South Korea's semiconductor exports increased by 137.6% year-on-year in early February, reaching $6.73 billion

SMIC Announces Q4 2025 Financial Results: Steady Progress in Performance

Samsung to Begin Mass Production of HBM4 as Early as Next Week, Projects Over Threefold Increase in HBM Sales This Year

CFM Reports Latest DDR5 RDIMM Prices, Exceeding 100% Increase Compared to Last Quarter

Intel and AMD Face Server CPU Delivery Delays in China Due to 3nm Capacity Bottleneck

Lexar Launches JumpDrive Solid State Dual Drive D500 USB

Strong Demand for Memory Chips Drives Full Capacity at Winbond Electronics, DRAM Contract Prices Surge by Nearly 50%

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Newsflash

Avary Holding: Strong Growth in AI Servers, Landmark Year for Computing Power Orders

TSMC Reports Record March 2026 Revenue of NT$415.191 Billion

Institution: Global PC Shipments Grew 3.2% YoY in 2026Q1, Expect Continued Memory Price Hikes in Q2 to Squeeze Vendor Gross Margins

Maxio Technology Plans Private Placement to Raise Up to 2.062 Billion Yuan for Memory Controller Chip Series Product R&D Project

Seagate Sells Lyve Cloud Storage Business to Wasabi, Focuses on Mass-Capacity Storage

Lenovo Completes Acquisition of Enterprise Storage Provider Infinidat

Reports Indicate Dimensity 9600 (Pro) to Use TSMC N2p Process, Support LPDDR6 and UFS 5.0

Samsung and SK hynix Reportedly Shift to 3-5 Year Long-Term Supply Contracts

Tencent Cloud Announces 5% Price Increase for AI Computing, Container Services, and EMR Products

Longsys: SPU Still in Early Commercialization Stage, Accurate Quantification Difficult

Hot News

As trade selling pressure gradually fades and the market regains calm, the spot memory market has largely remained stable this week

Notice of 2026 Qingming Festival Holiday

MemoryS 2026 Agenda Released

Spot Market Inversion Worsens: Prices for Industrial Low-Capacity SSDs, DDR SODIMM, and LPDDR4X Products Increased This Week

SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026

Samsung and Micron Split Initial LPDDR5X Orders for S26 Series, Subsequent Price Negotiations Uncertain

SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory ‘HBF’

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