Cisco Launches 3nm AI Networking Chip Silicon One G300

On February 10th, Cisco released the Silicon One G300, a 3nm AI switching chip. A single device supports 102.4Tbps Ethernet switching capacity and is optimized for large-scale AI clusters. The chip integrates Cisco's proprietary 200Gbps SerDes and features a 252MB on-chip shared buffer, capable of absorbing 2.5 times the industry average of burst traffic. It also improves congestion response speed by 100,000 times through hardware-level path load balancing.