Shenghe Jingwei's IPO on the Science and Technology Innovation Board Approved

Recently, Shenghe Jingwei Semiconductor Co., Ltd.'s IPO application was approved by the Shanghai Stock Exchange Listing Committee. As a leading global integrated circuit wafer-level advanced packaging and testing company, Shenghe Jingwei's IPO is sponsored by China International Capital Corporation (CICC). It plans to issue 536 million shares and raise 4.8 billion yuan, which will be invested in two major projects: 3D multi-chip integrated packaging and ultra-high-density interconnect 3D multi-chip integrated packaging. Financial data shows that the company's performance has grown rapidly in recent years. From 2023 to 2025, operating revenue increased from 3.038 billion yuan to 6.521 billion yuan, and net profit jumped from 34.1306 million yuan to 923 million yuan.