Guangzhou Signs Two Semiconductor Projects Worth Over 10 Billion Yuan, Boosting High-End Chip Industry

Recently, Guangzhou held a city-wide high-quality development conference, where 57 major projects were signed, with a total investment of 130.5 billion yuan. Among these signings, Guangzhou focused on the semiconductor and integrated circuit sector, welcoming two major projects worth over 10 billion yuan each.

The Huangpu AI Chip High-End Integrated Circuit Substrate Project and the Huangpu AI Computing Power High-End Printed Circuit Board Project were both located in Huangpu District, with a planned total investment of 10 billion yuan each. The signing of these two projects will strongly drive Guangzhou's semiconductor and integrated circuit industry towards high-end development, further solidify the industrial chain foundation, and help build a national advanced manufacturing base.