ACM recently secured multiple orders for advanced packaging equipment from several global clients.

According to reports, ACM  recently received several orders for advanced packaging equipment from leading global semiconductor and technology companies. These orders cover a variety of solutions, including coating, developing, wet etching, photoresist removal, cleaning, and electroplating, and are widely used in various stages of advanced packaging processes. Specifically, these orders include: multiple wafer-level advanced packaging electroplating and wet etching equipment from a leading global packaging and testing company in Singapore, expected to be delivered in the first quarter of 2026; a panel-level advanced packaging negative pressure cleaning system from a leading global semiconductor packaging manufacturer outside mainland China, also expected to be delivered in the first quarter of 2026; and multiple wafer-level advanced packaging wet etching equipment from a leading North American technology company, expected to be delivered later this year.