A high-end semiconductor packaging substrate project, with a total investment of 2.55 billion yuan, has been launched in Ningbo

Recently, Kaitou Group, together with the Beilun District Venture Capital Fund of Funds, signed an investment agreement with Zhongshan Xincheng Semiconductor Co., Ltd., marking the official establishment of a high-end semiconductor packaging substrate project in Beilun District, Ningbo.

The project, with a total investment of approximately 2.55 billion yuan, will be implemented in two phases. It will construct an intelligent factory integrating R&D and manufacturing in the Xinhang Town, with a planned land area of ​​approximately 65 mu (approximately 4.3 hectares). The project targets cutting-edge fields such as smartphones, AI data centers, and 5G communications, focusing on the R&D and mass production of high-end chip packaging substrates, aiming to achieve domestic substitution of key products.