Reports indicate that TSMC's 3nm mass production in the US could begin as early as the second half of 2027

According to foreign media reports, driven by demand for AI chips, TSMC has significantly accelerated its overseas and domestic fab construction pace. Reports suggest that the construction cycle for its overseas wafer fabs has been shortened from six quarters to four to five quarters, with the US fab construction timeline reduced from three years to 1.5 to two years, gradually approaching the efficiency levels of its domestic Taiwanese operations.

Regarding Fab 21 in Arizona, the P2 fab's civil engineering is complete, and cleanroom and electromechanical integration are underway. 3nm mass production could begin as early as the second half of 2027. Simultaneously, TSMC is accelerating its advanced production capacity in Taiwan, with Fab 20 in Hsinchu and Fab 22 P3 in Kaohsiung expected to begin equipment installation in the third quarter of 2026, focusing on 2nm and below advanced processes.