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Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies

2026-07-27 09:29 (UTC+0) Enterprise News

Pushing Ahead in On-Device AI! Samsung’s LPDDR5X-PIM Solution Rumored to Debut in August

2026-07-24 10:15 (UTC+0) Industry News

SK hynix Starts Developing 3D Stacked DRAM and Secures Partnerships with Specific Customers

2026-07-24 09:44 (UTC+0) Industry News

AMD's Latest Memory Strategy Revealed, Samsung's "HBM + RDIMM" Dual-Track Solution Fuels Helios

2026-07-24 09:26 (UTC+0) Industry News

South Korea's First of Three National Mega-projects Gets Underway, Samsung's New Asan Plant Targets HBM Mass Production by 2029

2026-07-23 10:05 (UTC+0) Industry News

AMD and Anthropic Forge Deep Partnership, 2 GW of AI Compute Power Set for Deployment

2026-07-23 10:02 (UTC+0) Industry News

SK Hynix Increases Investment in Cheongju P&T7 Project to Meet Surging AI Memory Demand

2026-07-22 10:31 (UTC+0) Enterprise News

TSMC Reportedly Plans Price Hikes of Up to 25% in 2027

2026-07-22 10:03 (UTC+0) Industry News

CXMT Reportedly Accelerates DDR6 Layout, Aiming for World's First Mass Production of LPDDR6 in 2H2026

2026-07-21 09:56 (UTC+0) Industry News

Samsung Reportedly Deepens Ties with NVIDIA, Scales Up NAND Flash Supply

2026-07-21 09:55 (UTC+0) Industry News

64GB eMMC Prices Dip on Weak Demand and Market Competition

2026-07-21 08:01 (UTC+0) Weekly Review

Adata Chen Li-Pai: Memory to Be One of the Most Scarce Resources in the Next Decade, Prices Still Seen Rising in 2H26

2026-07-20 09:28 (UTC+0) Industry News

SK Group Tae-won Chey: Semiconductor Demand to Surge Over 50% Next Year, Supply Gap Likely to Widen

2026-07-20 09:26 (UTC+0) Industry News

Kioxia Ordered to Pay $229 Million in U.S. NAND Flash Patent Infringement Case

2026-07-17 10:01 (UTC+0) Industry News

Samsung Electronics Establishes New Backend Process Organization to Tackle High-Density Routing Challenges in HBM4

2026-07-17 09:59 (UTC+0) Industry News

【CFM Research】Memory Prices to Rise Further in the Second Half of the Year

Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions

Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3

Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies

Pushing Ahead in On-Device AI! Samsung’s LPDDR5X-PIM Solution Rumored to Debut in August

SK hynix Starts Developing 3D Stacked DRAM and Secures Partnerships with Specific Customers

AMD's Latest Memory Strategy Revealed, Samsung's "HBM + RDIMM" Dual-Track Solution Fuels Helios

South Korea's First of Three National Mega-projects Gets Underway, Samsung's New Asan Plant Targets HBM Mass Production by 2029

AMD and Anthropic Forge Deep Partnership, 2 GW of AI Compute Power Set for Deployment

SK Hynix Increases Investment in Cheongju P&T7 Project to Meet Surging AI Memory Demand

TSMC Reportedly Plans Price Hikes of Up to 25% in 2027

CXMT Reportedly Accelerates DDR6 Layout, Aiming for World's First Mass Production of LPDDR6 in 2H2026

Samsung Reportedly Deepens Ties with NVIDIA, Scales Up NAND Flash Supply

64GB eMMC Prices Dip on Weak Demand and Market Competition

Adata Chen Li-Pai: Memory to Be One of the Most Scarce Resources in the Next Decade, Prices Still Seen Rising in 2H26

SK Group Tae-won Chey: Semiconductor Demand to Surge Over 50% Next Year, Supply Gap Likely to Widen

Kioxia Ordered to Pay $229 Million in U.S. NAND Flash Patent Infringement Case

Samsung Electronics Establishes New Backend Process Organization to Tackle High-Density Routing Challenges in HBM4

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Newsflash

Samsung Unveils LPDDR5X-PIM Performance, Doubling AI Inference Speed

Samsung Electronics Launches P9 and P7 Portable SSDs with USB4 Interface

Huawei and HP Sign Patent Cross-License Agreement

Micron: The 'Memory Wall' Limiting AI Performance May Worsen

SK Hynix Reaffirms: Mass Production of 12-Layer HBM4 Underway, 16-Layer Product Enters Qualification Phase

U.S. May Allow Apple to Source Memory Chips from CXMT and YMTC

XPeng's Robotics Business Raises Over $900 Million in First Funding Round

Samsung Reportedly Ramps Up Investment in China NAND Production Facility

Institution: Global Smartphone Market to Fall 14% in 2026 as Samsung is Expected to Retake No. 1 Position

Samsung Electronics Reportedly Prioritizes Yield and Efficiency Over Volume Growth, DRAM Production Ramp Slower Than Expected

Hot News

YMTC Plans to Raise 33 Billion Yuan in STAR Market IPO; Q1 2026 Revenue Already Reaches 74% of Full-Year 2025

Micron Warns: AI 'Memory Wall' Is Intensifying, HBM Becomes Key Bottleneck

Rising Resource Prices Continue to Push Up Costs; DDR5 SODIMM and UDIMM Prices Climb This Week

SK Hynix H1 Report: US Market Revenue Surpasses 64%, Dual AI Giant Client Landscape Takes Shape

Samsung 1d DRAM Reportedly Passes Thermal Test Yield Targets, Mass Production Timeline Revealed

Samsung Electronics Semiannual Report: DS Division Contributes 97.4% of Profits; Exports to China Surpass Those to the U.S.

Sandisk Announces FY2028–2030 Financial Targets, Pledges 100% of Excess Cash Back to Shareholders

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