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Samsung Galaxy Book6 Series Available in the U.S. on March 11, Featuring First Client SoCs Built on Intel 18A

2026-02-24 10:16 (UTC+0) Enterprise News

Kioxia Sampling UFS 5.0 Embedded Flash Memory Devices, Achieving Approximately 10.8GB/s Effective Read/Write Performance with 2 Lanes

2026-02-24 07:38 (UTC+0) Enterprise News

ASML Announces Major Breakthrough in EUV Lithography, Potentially Boosting Chip Production Capacity by 50% by 2030

2026-02-24 02:37 (UTC+0) Financial Analys

U.S. Releases and Then Withdraws 1260H List, YMTC and CXMT Removed While Alibaba, Baidu, and Others Added

2026-02-14 08:16 (UTC+0) Industry News

Micron Announces Mass Production of Its Fastest-Ever Data Center SSD, the World's First PCIe Gen6 SSD:b9650 Series

2026-02-14 08:05 (UTC+0) Industry News

TuringEvo Partners with National Integrated Circuit Innovation Center to Deepen Full-Chain Collaboration in AI Chips

2026-02-14 04:03 (UTC+0) Financial Analys

Notice of Chinese New Year Holiday

2026-02-13 08:57 (UTC+0) Industry News

Global Memory Market Hits Record High, 4Q25 DRAM/NAND Flash Revenue Market Share Rankings Released

2026-02-13 08:05 (UTC+0) Financial Analys

Shenzhen Backs In-Memory Computing with New AI Action Plan

2026-02-13 04:29 (UTC+0) Industry News

Cisco Unveils 3nm AI Network Chip Silicon One G300, Defining the Foundation for the "Agent Era" Network with 102.4Tbps Bandwidth

2026-02-13 03:55 (UTC+0) Industry News

Hua Hong Semiconductor's Q4 2025 Revenue Hits Record High, Driven by eNVM and PMIC Platforms

2026-02-12 12:15 (UTC+0) Industry News

Lenovo's Q3 Results Hit Record High; Yang Yuanqing Warns Memory Prices May Double

2026-02-12 10:27 (UTC+0) Industry News

Samsung Electronics: Industry-First Mass Production and Delivery of HBM4, HBM Sales Projects to More Than Triple in 2026

2026-02-12 10:06 (UTC+0) Industry News

Micron CFO: HBM4 Mass Production and Shipments Start, One Quarter Ahead of Schedule

2026-02-12 02:29 (UTC+0) Industry News

South Korea Invests 4.5 Trillion Won to Build 40nm Wafer Fab, Implementing Multiple Measures to Support Fabless Enterprises

2026-02-11 10:25 (UTC+0) Industry News

CFMS｜MemoryS 2026: Shenzhen, March 27

Global Memory Market Hits Record High, 4Q25 DRAM/NAND Flash Revenue Market Share Rankings Released

Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%

Samsung Galaxy Book6 Series Available in the U.S. on March 11, Featuring First Client SoCs Built on Intel 18A

Kioxia Sampling UFS 5.0 Embedded Flash Memory Devices, Achieving Approximately 10.8GB/s Effective Read/Write Performance with 2 Lanes

ASML Announces Major Breakthrough in EUV Lithography, Potentially Boosting Chip Production Capacity by 50% by 2030

U.S. Releases and Then Withdraws 1260H List, YMTC and CXMT Removed While Alibaba, Baidu, and Others Added

Micron Announces Mass Production of Its Fastest-Ever Data Center SSD, the World's First PCIe Gen6 SSD:b9650 Series

TuringEvo Partners with National Integrated Circuit Innovation Center to Deepen Full-Chain Collaboration in AI Chips

Notice of Chinese New Year Holiday

Global Memory Market Hits Record High, 4Q25 DRAM/NAND Flash Revenue Market Share Rankings Released

Shenzhen Backs In-Memory Computing with New AI Action Plan

Cisco Unveils 3nm AI Network Chip Silicon One G300, Defining the Foundation for the "Agent Era" Network with 102.4Tbps Bandwidth

Hua Hong Semiconductor's Q4 2025 Revenue Hits Record High, Driven by eNVM and PMIC Platforms

Lenovo's Q3 Results Hit Record High; Yang Yuanqing Warns Memory Prices May Double

Samsung Electronics: Industry-First Mass Production and Delivery of HBM4, HBM Sales Projects to More Than Triple in 2026

Micron CFO: HBM4 Mass Production and Shipments Start, One Quarter Ahead of Schedule

South Korea Invests 4.5 Trillion Won to Build 40nm Wafer Fab, Implementing Multiple Measures to Support Fabless Enterprises

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MacBook Neo Becomes First Apple Laptop to Feature MediaTek Wi-Fi and Bluetooth Chips

Qwen App Launches New Qwen-Image 2.0 Model for Image Generation and Editing

Sources Indicate Samsung Evaluating 2nm Process Technology for Next-Gen HBM

Silicon Motion Launches SM8008 PCIe Gen5 SSD Controller Designed for Data Center Boot Drives

Sources Indicate Samsung and Nvidia Form Alliance on Next-Generation NAND Development

Cambricon Releases 2025 Annual Report: Revenue Surges 453%, Achieving First-Ever Profitability

IBM Releases Quantum-Centered Supercomputing Reference Architecture, Ushering in a New Era of Hybrid Computing

Xiaomi Debuts Miloco Smart Solution at AWE 2026

NIO Achieves First Quarterly Profit; Founder Li Bin Citing Increased Costs Per Vehicle Due to Rising Storage and Raw Material Prices

Acer: 2025 Consolidated Revenue Reaches NT$275.63 Billion, Up 4.1% YoY

Hot News

Samsung and Micron Split Initial LPDDR5X Orders for S26 Series, Subsequent Price Negotiations Uncertain

SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory ‘HBF’

Samsung Electronics' 1c DRAM Yield Exceeds 80%, HBM4 Yield Approaches 60%

South Korea's Semiconductor Exports Surge 134.1% in First 20 Days of February

Notice of Chinese New Year Holiday

Global Memory Market Hits Record High, 4Q25 DRAM/NAND Flash Revenue Market Share Rankings Released

Samsung Electronics: Developing zHBM, Which Cores on Stacking HBM into a 3D Structure

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