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PSMC to Hike Memory Foundry Quotes by 45% Starting July, New Capacity to Ramp in November

2026-07-15 10:06 (UTC+0) Industry News

Maxio Technology: H1 Net Profit Exceeds RMB 500 Million; Q2 Net Profit Surges Over 57 Times QoQ

2026-07-15 09:32 (UTC+0) Enterprise News

SK hynix Reportedly Accelerates Yongin Fab Rollout: Equipment Orders Underway, Trial Production Targeted for February Next Year

2026-07-14 10:19 (UTC+0) Industry News

Rising Costs Lift DDR5 UDIMM Prices; DDR4 UDIMM Rebound on Retail Hikes

2026-07-14 09:18 (UTC+0) Weekly Review

SK hynix Takes Early Lead in HBM4 Commercialization with Reported First Mass Shipments to NVIDIA

2026-07-13 10:09 (UTC+0) Industry News

Samsung-Produced Tesla AI5 Chip Completes Tape-Out, Mass Production Scheduled for 2027

2026-07-13 10:08 (UTC+0) Industry News

Nvidia CEO: Quarterly Revenue Nears $100 Billion as Growth Accelerates; Denies Delay of Rubin Ultra

2026-07-13 09:43 (UTC+0) Industry News

Samsung Electronics to bring forward opening of 1st Yongin chip plant to 2029

2026-07-13 09:36 (UTC+0) Industry News

Phison Posts First-Half Revenue Exceeding TWD 100 Billion: Strong AI Inference Demand Drives Order Visibility to 2027

2026-07-10 10:00 (UTC+0) Enterprise News

Samsung and SK Hynix Face a Dilemma: To Adopt Hybrid Bonding for Next-Gen HBM?

2026-07-10 09:52 (UTC+0) Industry News

Nanya Technology: Capacity Surges Nearly 70%, DRAM Shortage Seen Lasting Through 2028

2026-07-10 09:15 (UTC+0) Industry News

Micron Boosts Domestic Investment with Pouring $250 Billion and Securing Critical Supply Chains

2026-07-10 09:12 (UTC+0) Enterprise News

GigaDevice: Memory Chip Products See Volume and Price Growth, H1 Net Profit Expected to Surge by 1,099% YoY

2026-07-09 10:34 (UTC+0) Industry News

Intel Unveils XBM Memory Patent Technology, Aiming at HBM4

2026-07-09 10:11 (UTC+0) Industry News

Samsung Reportedly Delays Mass Production Plan for CXL 3.1 Memory Modules

2026-07-08 10:48 (UTC+0) Industry News

【CFM Research】Memory Prices to Rise Further in the Second Half of the Year

Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions

Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3

PSMC to Hike Memory Foundry Quotes by 45% Starting July, New Capacity to Ramp in November

Maxio Technology: H1 Net Profit Exceeds RMB 500 Million; Q2 Net Profit Surges Over 57 Times QoQ

SK hynix Reportedly Accelerates Yongin Fab Rollout: Equipment Orders Underway, Trial Production Targeted for February Next Year

Rising Costs Lift DDR5 UDIMM Prices; DDR4 UDIMM Rebound on Retail Hikes

SK hynix Takes Early Lead in HBM4 Commercialization with Reported First Mass Shipments to NVIDIA

Samsung-Produced Tesla AI5 Chip Completes Tape-Out, Mass Production Scheduled for 2027

Nvidia CEO: Quarterly Revenue Nears $100 Billion as Growth Accelerates; Denies Delay of Rubin Ultra

Samsung Electronics to bring forward opening of 1st Yongin chip plant to 2029

Phison Posts First-Half Revenue Exceeding TWD 100 Billion: Strong AI Inference Demand Drives Order Visibility to 2027

Samsung and SK Hynix Face a Dilemma: To Adopt Hybrid Bonding for Next-Gen HBM?

Nanya Technology: Capacity Surges Nearly 70%, DRAM Shortage Seen Lasting Through 2028

Micron Boosts Domestic Investment with Pouring $250 Billion and Securing Critical Supply Chains

GigaDevice: Memory Chip Products See Volume and Price Growth, H1 Net Profit Expected to Surge by 1,099% YoY

Intel Unveils XBM Memory Patent Technology, Aiming at HBM4

Samsung Reportedly Delays Mass Production Plan for CXL 3.1 Memory Modules

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Newsflash

Macronix July Revenue Breaks NT$7 Billion Barrier, Hits New Monthly Record

Winbond Electronics: July Revenue Reached NT$26.773 Billion, Up 30% Month-on-Month

NVIDIA Reportedly Developing Technology to Let SSDs Serve as Extra VRAM

Winbond: Kaohsiung Module A Monthly Capacity to Expand to 24,000 Wafers, Module B Expansion Plan Initiated

Adata's July Revenue Hits Another Record High, Soaring 331.3% YoY

Adata: Memory Price Uptrend to Continue Through 1H27, DRAM Supply to Tighten Further in 2027

AMD Announces Acquisition of AI Inference Chip Startup Taalas

SK Hynix Invests $38 Billion to Build New DRAM and NAND Flash Facilities

CoreWeave and Solidigm Sign Multi-Year Agreement to Strengthen Integrated AI Cloud Platform

SanDisk: Minimum Expected Revenue from Signed Agreements Stands at $93.9 Billion, with Actual Revenue Expected to Exceed This Amount

Hot News

SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand

CFM: Soaring Memory Costs Suppress End-User Demand; Consumer-Grade NAND Market Faces Pressure in Q4

New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND

64GB eMMC Prices Fall Again This Week Amid Trading Market Inventory Backlog and Short-Term Digestion Challenges

CFM: Divergence in Server Customers' Price Acceptance for eSSDs; Q3 Price Hikes by Memory Original Manufacturers Range from 10% to 30%

SK hynix Unveils First HBF Standard Specifications with Sandisk

Samsung Electronics: 70% of Memory Capacity Locked by LTAs; HBM Shortfall Expected to Widen Further Next Year

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