AMEC Releases Two Etching Machines, Directly Addressing Memory Chip Manufacturing

Recently, AMEC launched four semiconductor manufacturing equipment products covering silicon-based and compound semiconductor fields. Two of these etching machines are directly related to memory chip manufacturing.

The next-generation inductively coupled plasma (ICP) etching machine, Primo Angnova™, is designed for the high aspect ratio etching needs of advanced nodes. It provides a domestically controllable ICP etching process solution for 5nm and below logic chips, as well as advanced memory chips of equivalent technical difficulty.

The high-selectivity etching machine, Primo Domingo™, is designed for the process requirements of GAA, 3D NAND, and DRAM devices. It overcomes the challenge of high-selectivity etching, filling the gap in domestic self-sufficiency in key etching processes for next-generation 3D semiconductor device manufacturing.