Recently, the Shenzhen Municipal Industry and Information Technology Bureau officially issued the Action Plan for Promoting High-Quality Development of the Artificial Intelligence Server Industry Chain in Shenzhen (2026–2028). The plan outlines eight key areas across the AI server industry chain, emphasizing Shenzhen’s industrial strengths and adhering to innovation-driven, software-hardware coordinated development. It aims to foster integrated and innovative growth across the entire industry chain, building the most complete supporting facilities, the most efficient resource allocation, and the most robust innovation ecosystem for the AI server industry chain, ultimately establishing Shenzhen as a hub for large-scale AI computing cluster R&D and manufacturing.
The plan sets development targets for 2028: significant growth in production capacity and shipment volume across the entire AI server industry chain, with a notable increase in global market share for key products such as core chips, storage, printed circuit boards (PCBs), power and energy storage, optical modules, and passive components. It also aims to achieve technological breakthroughs in core chips and key products, cultivate a group of specialized and sophisticated enterprises with strong technological capabilities and market advantages, and form an industrial echelon characterized by collaborative development among enterprises of all sizes.
Within the key areas, the plan identifies high-end storage as a priority breakthrough direction. It proposes accelerating R&D and application of storage chips, advancing technological breakthroughs in advanced packaging, and enhancing the global competitiveness of high-end storage products such as enterprise-grade SSDs and memory modules. At the same time, it emphasizes R&D in new storage technologies including near-memory packaging and in-memory computing, aiming to create a high-end storage product supply system tailored for large model training and supercomputing centers.
On the implementation path, the plan supports leading enterprises in advancing storage chip R&D and applications, promoting iterative advancements in advanced packaging technologies, with a focus on developing enterprise-grade SSDs and enterprise-grade memory modules. To ensure the effective implementation of these goals, Shenzhen will introduce a collaborative innovation model featuring "leading enterprises defining the challenges and upstream and downstream partners solving them together," encouraging leading enterprises to drive joint R&D and technological breakthroughs across the storage industry chain. It will also leverage the Electronic Components and Integrated Circuits International Trading Center to enhance the resilience and security of the storage chip supply chain.
The introduction of this three-year action plan marks Shenzhen’s accelerated efforts to build a complete industry chain encompassing storage chip R&D, packaging and testing, and high-end storage product manufacturing. It is expected to further enhance China’s self-sufficiency and global competitiveness in the AI server storage sector.
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